

(´º½ºÅë½Å= ±è»ó¼· ±âÀÚ)ÀÎÇÏ´ë ±èÀçȯ ±â°è°øÇаú ±³¼ö°¡ ÃÖ±Ù ±¹Á¦Ã·´Ü¼ÒÀçÇùȸ(IAAM‧International Association of Advanced Materials)°¡ ¼ö¿©ÇÏ´Â ¿ÃÇØÀÇ ¸Þ´Þ ¼ö»óÇÑ´Ù.
31ÀÏ ÀÎÇÏ´ë¿¡ µû¸£¸é ±èÀçȯ ±³¼ö´Â »õ·Î¿î ¼¼´ëÀÇ ±â¼ú°ú âÀÇÀû ºÐ¾ß¿¡ ±â¿©ÇÑ Á¡À» ÀÎÁ¤¹Þ¾Æ ¹ßÆ® ±¹Á¦Çмú´ëȸ(Baltic Conference Series)¿¡¼ ¼±Á¤µÆ´Ù.
±è ±³¼ö´Â ¼¿·ê·Î¿À½º ºÐ¾ß¿¡¼ µ¶º¸ÀûÀÎ ¼º°ú¸¦ º¸ÀÌ¸ç ±â°è°øÇÐ ºÐ¾ß¿¡¼ À¯ÀÏÇÏ°Ô Çѱ¹¿¬±¸Àç´ÜÀÌ Áö¿øÇϴ âÀÇ¿¬±¸´ÜÀ» µÎ ¹øÂ° À̲ø°í ÀÖ´Ù.
ƯÈ÷, 2003~2012³â EAPap Actuator âÀÇ¿¬±¸´ÜÀ» À̲ø¸ç ¼¼°è ÃÖÃÊ·Î ¼¿·ê·Î¿À½º Á¾ÀÌ¿¡ Àü±â¸¦ °¡ÇÏ¸é ¿òÁ÷ÀÌ´Â Àü±â ÀÛµ¿ Á¾ÀÌ(EAPap‧Electro-Active Paper)¸¦ °³¹ßÇß´Ù.
¿òÁ÷ÀÌ´Â Àü±â ÀÛµ¿ Á¾ÀÌ´Â EAPap Á¾·ù¿¡ µû¶ó Á¾À̽ºÇÇÄ¿, º¯Çü·ü ¼¾¼, »ýä ¸ð¹æ ·Îº¿ µîÀ¸·Î ÀÀ¿ëÀÌ °¡´ÉÇÏ´Ù.
¶Ç, 2015³â ¹Ì·¡º¹ÇÕÀç âÀÇ¿¬±¸´ÜÀ» ²Ù·Á ģȯ°æ °í°µµ ±¸Á¶º¹ÇÕÀç¿¡ ³ª³ë¼¿·ê·Î¿À½º¸¦ Ȱ¿ëÇϱâ À§ÇÑ ¿¬±¸¸¦ ÁøÇà ÁßÀÌ´Ù.
³ª³ë¼¿·ê·Î¿À½º´Â °µµ¿Í °¼º, ±¤ÇÐÀû Ư¼º, ¿Àû ¾ÈÁ¤¼º µî¿¡¼ ¿ì¼öÇØ ¹Ì·¡ ¼ÒÀç·Î °¢±¤¹Þ°í ÀÖ´Ù.
ÇÑÆí, ±è ±³¼ö´Â ³»³â SPIE Áö´É±¸Á¶¹° Àç·á/ ºñÆÄ±« °Ë»ç ½ÉÆ÷Áö¾ö¿¡¼ ³ª³ë- ¹ÙÀÌ¿À- IT ¼¾¼ ¹× 3D ½Ã½ºÅÛ Çмú´ëȸÀÇ Á¶Á÷À§¿øÀåÀ» ¸Ã´Â´Ù.
SPIE-Symposium on Smart Structures Materials /NDE: Nano-, Bio-, Info-Tech Sensors and 3D Systems Conference